In this study, we developed a new enzyme hybrid material composed

In this study, we developed a new enzyme hybrid material composed of multiple layers on an Au-FGO electrode. Multiple

layers, composed of the enzyme hybrid and polymers, were spin coated layer by layer on to the Au-FGO. Our findings show that the multiple layers with Au-FGO exhibit a more stable response to glucose in the presence of interference substances in urine. In addition, measurements of urine samples of patients with hyperglycemia (n = 30) show good correlation with blood glucose of same patients measured by commercially available glucose meters. This prospective study was approved by the institutional review board at our institute and informed consent was obtained from all subjects. Urine and serum Selleck Entinostat sample collection was performed Dabrafenib mouse between December 2012 and May 2013 from 30 subjects that met our inclusion criteria and consented to participate. The number recruited was based on sample size estimation, and the inclusion criterion was that patients

be scheduled for orthopedic surgery at our hospital. Silver nitrate (AgNO3), tetraethoxysilane (TEOS), sodium borohydride (NaBH4), ammonium hydroxide (NH4OH), poly(ethylene glycol) (PEG) (Mn = 10,000 g/mol), and 3-aminopropyltriethoxysilane (3-APTES) were purchased from Sigma–Aldrich. Glucose oxidase (GOx) (from Aspergillus niger, >100 U/mg), anhydrous ethanol (C2H6O), albumin from bovine serum (BSA), glutaraldehyde, nafion® perfluorinated resin, 1H,1H,2H,2H-perfluorodecyl acrylate, 1,3-bis(trifluoromethyl) benzene, d-(+)-glucose (reagent grade), and N-[Tris(hydroxymethyl) methyl]-2-aminoethanesulfonic acid sodium salt (TES) buffer were also obtained

from Sigma–Aldrich. As shown in Fig. 1 the Au electrode PCB was fabricated. Approximately 250 gold electrode chips on each 4 in glass wafer were fabricated during the process (Fig. 1(a)). Depsipeptide manufacturer Each electrode chip is composed of working, counter, and reference electrode, these are denoted as WE, CE, and RE, respectively (Fig. 1(b)). Prior to being diced into each chip, the glass wafer was spin coated with the aforementioned layers to form multilayers on top of the Au-electrode. Each electrode chip was then diced and glued to the region indicated by arrows (Fig. 1(c and d)). We fabricated two types of multilayer Au-chips, one is for in-house use as a prototype and the other is for a portable prototype (not shown in this article). Shown in Fig. 2 is a customized prototype of the read out system for the fabricated chips. As can be seen in Fig. 2(a), the layout and PCB of the read out circuit, each board has five readout channels that are able to collect amperometric data from Au PCBs implemented in each channel. In a single run, five different Au-PCB chips can be mounted and with the assistance of a lever each platform can be precisely inserted into the desired solutions kept in eppendorf tubes (Fig. 2(b)).

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